ADLINK Technology, a leading global provider of embedded building blocks and application-ready intelligent platforms, introduces its latest COM Express Compact Size Type 6 module, the cExpress-WL, featuring the new 8th Generation Intel® Core™ processor (formerly “Whiskey Lake-U”). For the first time, ultra-low-power Intel® Core™ i7 and i5 processors will support 4 cores compared to the previous generation 2-core processors, bringing an almost 40% gain in performance while not significantly increasing the price level of the module.
A new critical feature is support for USB 3.1 Gen 2 that for the first time allows for a maximum transfer speed of 10 Gbit/s, making the cExpress-WL ideally suited for transferring uncompressed UHD video streams from multiple USB cameras. The combination of USB 3.1 Gen 2 paired with a high performance Intel® UHD Graphics, a scalable choice of processor and Intel® Distribution of OpenVINO™ Toolkit makes this module a highly flexible building block for emerging AI, machine vision and surveillance applications. More traditional applications that can benefit from the low power consumption and high performance of the cExpress-WL are medical ultrasound, test and measurement, factory automation, and industrial HMI.
The cExpress-WL features quad- and dual-core 8th Gen Intel® Core™ processors in a 15W TDP envelope and up to 64GB dual channel non-ECC DDR4 memory, providing uncompromised performance in a compact form factor. The Intel® Gen 9 LP Graphics Core supports up to 3 independent displays with a combination of DisplayPort/HDMI/LVDS, eDP or VGA outputs to support both new and legacy applications. The module is also equipped with up to 8 PCIe lanes for system expansion.
- 8th Gen quad/dual-core Intel® Core™ Processors
- Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
- Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays
- Up to eight PCIe lanes, GbE
- Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0
- Supports Smart Embedded Management Agent (SEMA) functions
- Extreme Rugged operating temperature: -40°C to +85°C (optional)
Available wide range voltage input (5V to 20V) covers most standard applications, including outdoor scenarios such as battery or solar powered setups, and simplifies carrier board power design requirements. Wide range voltage design contributes to simplified carrier power and also gives more tolerance for the power input from carrier and de-complexity of the power circuit design in carrier.
ADLINK supports Embedded Linux through the industry standard Yocto Project® (https://github.com/ADLINK/meta-adlink-x86-64bit), Ubuntu LTS (64-bit), CentOS (64-bit) and Windows® 10 (64-bit).
The module comes standard with AMI Aptio V UEFI BIOS or can instead be equipped with an Intel® Slim Bootloader. Slim Bootloader is an open-source boot firmware, built from the ground up to be small, secure and optimized to run on Intel x86 architecture, and is specially designed to be small, fast and secure while also being extensible and extremely configurable for OEMs and system integrators.