Liquid Cooling Moves onto the Chip for Denser Electronics

Liquid Cooling Moves onto the Chip for Denser Electronics

Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating. Combined with connection technology that operates through structures in the cooling passages, the […]

Liquid Cooling Moves onto the Chip for Denser Electronics Read More »